Printed Circuit Board Assemblies

  • 3 High Speed Surface Mount Lines
  • Prototype Line
  • Auto Insertion Equipement
  • Spade Insertion Equipement
  • Vapor Phase Technology
  • Automated Optical Insertion (all boards are 100% AOI inspected)
  • Full In-House X-Ray Capabilities
  • Tin Lead Wave
  • Lead-Free Wave
  • Tin Lead Selective Solder
  • Lead-Free Selective Solder
  • Conformal Coating (Dip and Selective)
  • Wire and Cable Assemblies
  • Hand Assemblies
  • Box Build
  • Labeling (Customer Specific)
  • Surface Mount Lines Placement Up to 70 Micron Accuracy
  • Electrosensitive (ESD) Packaging
  • Customer Specific Packaging
  • Custom Foam-In-Place Packaging
  • Custom Packaging
  • Low-Medium-High Volume Assemblies
  • 0201 and Up Package Types